MicroSON®-3 SMD package
  • MicroSON®-3 SMD package
  • MicroSON®-3 SMD package

MicroSON®-3 SMD package

Designed for industrial UHF RFID applications under harsh conditions.

MicroSON®-3 RFID SMD package is a Small Outline No-leads (SON) package, incorporating the latest generation UHF Gen2v2 (RAIN) compliant RFID chips. The package is chip independent and therefore compatible with the leading RFID chip solutions in the market.

MicroSON®-3 is a near chip scale plastic encapsulated package with a copper lead frame substrate. It is a leadless package where electrical contact to the PCB is made by soldering the terminals on the bottom surface of the package to the PCB, instead of the conventional formed perimeter leads.

Maarten Dolf Desertine

Maarten Dolf Desertine
Manager New Business Development
Wijchen, Netherlands

Product Category


Application Fields

Sales Region

Key benefits

  • Reliable performance under harsh conditions
  • Moisture Sensitivity Level 1 (MSL-1) qualified
  • Tailored to fit industrial application requirements
  • RAIN compliant with the latest generation UHF Gen2v2 RFID chips
  • The possibility to package your application-specific RFID chip

Target applications

  • Ruggedized tag design
  • PCB Tagging and Tracking
  • Asset Management with high reliability requirements
  • Industrial Work In Progress tracking

Key features

  • Plastic extremely thin small outline package
  • No-leads, 3-terminals
  • Size 1.45 x 1.00 x 0.5 mm
  • For surface-mount assembly
  • Industrial (operating) temperature -40°C to +85°C
  • Storage temperature (package) -55°C to +125°C

Tailored package solutions play a key role in a connected world

NedCard develops semiconductor package solutions and offers related assembly and test services for various devices used in smart card, RFID, IoT and other enabling technologies.

We build on broad experience and apply extensive technical capabilities to meet the industry’s highest requirements. Trustworthiness is what makes us unique; we provide maximum security and cost efficient manufacturing while meeting high quality standards.

We have over 20 years of experience in offering package solutions for Banking & Payment, Telecom, eGovernment & Identification and Emerging markets. Our competence is your advantage.

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