NedCard develops semiconductor package solutions and offers related assembly and test services for various devices used in smart card, RFID, IoT and other enabling technologies.
We build on broad experience and apply extensive technical capabilities to meet the industry’s highest requirements. Trustworthiness is what makes us unique; we provide maximum security and cost efficient manufacturing while meeting high quality standards.
We have over 20 years of experience in offering package solutions for Banking & Payment, Telecom, eGovernment & Identification and Emerging markets. Our competence is your advantage.
NedCard is specialized in tailored package solutions. Over time we developed from a contract manufacturer (1995) into an advanced package solution provider, specialized in packages for semiconductor devices used in smart card, RFID, sensor, M2M and other enabling technologies. We have proven our competence in the smart card area and we are broadening our scope to provide the needs of the future. We are expanding our position in RFID, sensor and other enabling technologies by being the trusted, innovative and sustainable partner. We provide services in applications where our competences make a difference. NedCard recently introduced MicroSON®-3 SMD package; a Small Outline No-leads (SON) package designed for industrial applications. MicroSON®-3 is robust, reliable, small and compatible with leading RFID chip solutions in the market.
Maarten Dolf Desertine, Manager New Business Development, NedCard