Ralf Kodritsch, Director Global Segment Manager RFID Solutions, NXP Semiconductors

NXP is the ideal choice for any RFID implementation.

NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer.

  • NXP’s IP core technologies in processing, connectivity and security enabling secure connections for a smarter world
  • Worldwide #1 leadership position in innovative high-performance mixed signal solutions in the identification and automotive industry
  • More than 9,000 issued and pending patent families

As the world’s trusted provider of RFID solutions, NXP is the ideal choice for any RFID implementation. We offer the industry’s broadest and most differentiated silicon product portfolio, ranging from LF (125kHz), HF (13.56 MHz) and NFC (ISO 15693, 14443) to RAIN RFID (UHF 840 - 960 MHz). With our vast product ecosystem and network of partners, we provide true, end-to-end system solution support. As the leader in security and connectivity, NXP is committed to providing solutions that deliver unparalleled security and performance for a host of IoT markets, including smart city, smart retail, smart products, smart manufacturing and logistics.

Ralf Kodritsch, Director Global Segment Manager RFID Solutions, NXP Semiconductors

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NXP Semiconductors

Secure connections and infrastructure for a smarter world

NXP Semiconductors N.V. (NASDAQ:NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets.

Built on more than 60 years of combined experience and expertise, the company has over 30,000 employees in more than 30 countries and posted revenue of $9.26 billion in 2017. Find out more at www.nxp.com.

Full range of contactless semiconductor solutions

NXP Semiconductors Austria GmbH is the global competence center for secure contactless identification systems and focuses primarily on research & development, marketing, and technical support. The company provides the full range of contactless semiconductor solutions for RFID and NFC smart labels/tags, smart cards, near field communication, MIFARE ticketing, payment, and access control.

The site at Gratkorn sustains the global responsibility and leads the product development and global marketing.

Learn more at www.nxp.com

Continuous Growth Makes NXP UCODE the #1 RAIN RFID Tag IC

UCODE 8 Performance Drives Growth The first quarter of 2019 proved to be another strong one for NXP’s portfolio of RAIN RFID ICs. Not only did we ship more than two billion UCODE ICs, we also confirmed our number-one position for RAIN RFID tag IC revenue. NXP’s ongoing success with RAIN RFID tags can be credited to the best-in-class performance of our latest implementation of the RAIN RFID architecture, UCODE® 8, which enables quick programming and fast, highly accurate inventory counts. What’s more, UCODE 8 ICs consume 20% less power than competing solutions. The combination of high performance and low power consumption makes it possible to do faster, more reliable inventory counts and to manage items more easily in the supply chain. UCODE 8 also enables smaller designs and at the same time, brings tagging capabilities to smaller, previously difficult to tag retail items such as cosmetics and food.

NXP announced an ultra-low-cost NFC inlay

NXP and IDentive make IoT applications more accessible NXP Semiconductors has announced an ultra-low-cost radio frequency identification (RFID) inlay in collaboration with Identive. Using NXP’s near field communication (NFC) IC NTAG® 210µ, Identiv’s Dry Inlay (25 mm diameter) has launched at a price of $0.05 a tag for a minimum order of 20Ku. Compatible with any Android or Apple iOS 11 and up NFC-enabled device, the inlay is ideal for enabling NFC use cases including Internet of Things (IoT) and customer engagement applications.

NXP Launches New NTAG 424 DNA Tag Chip

NFC Chip with privacy enabled, multi-layered security for the IoT! NXP Semiconductors N.V. introduced its newest NTAG DNA tag chip that deliver privacy enabled, multi-layered security for NFC and IoT authentication applications. The NFC Forum-certified NTAG 424 DNA and NTAG 424 DNA TagTamper delivers cutting-edge security and privacy features, making it possible to confidently authenticate products and goods. These NFC chips provide cost-effective product protection and channel authentication for the fashion, food and beverages, pharmaceuticals, electrical appliances, and many other consumer and industrial goods markets ­– throughout the supply chain.

NedCard takes step into the field of industrial RFID applications

NedCard brings MicroSON®-3 UHF RFID SMD Package with NXP’s UCODE® 8/ 8m RAIN RFID ICs to the market MicroSON®-3 is tailored to fit industrial application requirements and can be used in a variety of RFID solutions and markets. NedCard, experienced partner in RFID, proudly presents MicroSON®-3 SMD with the UHF Gen2v2 (RAIN) compliant, UCODE® 8 and UCODE® 8m chips from NXP Semiconductors. MicroSON®-3 is a small outline no-leads (SON) SMD package that can be embedded into industrial applications via printed circuit board, or PCB. MicroSON®-3 is small and very thin, yet robust enough to withstand harsh industrial processes and high temperatures. It is a near chip scale plastic encapsulated package with a copper lead frame substrate. The leadless package makes electrical contact by soldering the bottom surface terminals to the PCB. The small size of the MicroSON®-3 design makes it a perfect package for leading RAIN RFID tag chips.

NXP Delivers New Connectivity to 2018 FIFA World Cup Finals

Smart Stadium Experience at 2018 FIFA World Cup Russia™ Finals As a pioneer and innovator for smart stadium solutions, NXP Semiconductors N.V. (NASDAQ:NXPI) today announced that with the use of its MIFARE® products, it helps bring secure, contactless ticketing to the ongoing 2018 FIFA World Cup Russia™ matches including the upcoming final game. The NXP contactless chip solution inside the match tickets provides fans with fast, hassle-free and safe access to Russia’s spectacular World Cup stadiums. Additionally, the company’s NTAG NFC technology was chosen to enable all new connected experiences with the Official Match Ball, the adidas Telstar 18. As the most innovative FIFA World Cup™ ball to date, the NFC technology allows the ball to interact with smartphones to display specific details of each ball and provides access to challenges, which users can enter in the run-up to the FIFA World Cup™.

Ralf Kodritsch
Ralf Kodritsch
Director Global Segment Manager RFID Solutions
Gratkorn, Austria
Michael Klein
Michael Klein
Manager, Marketing Communications
Austin, United States
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