NXP Semiconductors


Designed for High Anti-collision Rates and Reliable Reading

The ICODE ILT is a dedicated chip for passive, intelligent tags and labels supporting the ISO 18000-3 mode 3 RFID standard. This standard allows a reader to simultaneously operate multiple labels/tags within its antenna fi eld.

This allows the ICODE ILT to read up to 800 tags/second, making it the perfect choice for stacking and counting applications in close quarters.

Ralf Kodritsch

Ralf Kodritsch
Director Global Segment Manager RFID Solutions
Gratkorn, Austria

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Key Facts

  • Up to 240-bit of EPC memory
  • 96-bit tag identifier (TID) including 48-bit unique serial number
  • Up to 800 tags/s due to advanced anti-collision
  • EAS functionality
  • Recommissioning feature (privacy) with 32-bit kill password
  • 32-bit access password to allow a transition into the secured state
  • Fast initialization (write EPC)
  • Forward link: 25 kbit/s to 100 kbit/s
  • Return link: 53 kbit/s to 848 kbit/s


  • Supply Chain applications
  • Worldwide logistics
  • Healthcare and pharmaceutical supply chain
  • Medical lab automation
  • Document tracking
  • Casino chips
  • Laundry automation

NXP is the ideal choice for any RFID implementation.

NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer.

  • NXP’s IP core technologies in processing, connectivity and security enabling secure connections for a smarter world
  • Worldwide #1 leadership position in innovative high-performance mixed signal solutions in the identification and automotive industry
  • More than 9,000 issued and pending patent families
Solution News

NedCard takes step into the field of industrial RFID applications

NedCard brings MicroSON®-3 UHF RFID SMD Package with NXP’s UCODE® 8/ 8m RAIN RFID ICs to the market MicroSON®-3 is tailored to fit industrial application requirements and can be used in a variety of RFID solutions and markets. NedCard, experienced partner in RFID, proudly presents MicroSON®-3 SMD with the UHF Gen2v2 (RAIN) compliant, UCODE® 8 and UCODE® 8m chips from NXP Semiconductors. MicroSON®-3 is a small outline no-leads (SON) SMD package that can be embedded into industrial applications via printed circuit board, or PCB. MicroSON®-3 is small and very thin, yet robust enough to withstand harsh industrial processes and high temperatures. It is a near chip scale plastic encapsulated package with a copper lead frame substrate. The leadless package makes electrical contact by soldering the bottom surface terminals to the PCB. The small size of the MicroSON®-3 design makes it a perfect package for leading RAIN RFID tag chips.

Solution News

NXP Delivers New Connectivity to 2018 FIFA World Cup Finals

Smart Stadium Experience at 2018 FIFA World Cup Russia™ Finals As a pioneer and innovator for smart stadium solutions, NXP Semiconductors N.V. (NASDAQ:NXPI) today announced that with the use of its MIFARE® products, it helps bring secure, contactless ticketing to the ongoing 2018 FIFA World Cup Russia™ matches including the upcoming final game. The NXP contactless chip solution inside the match tickets provides fans with fast, hassle-free and safe access to Russia’s spectacular World Cup stadiums. Additionally, the company’s NTAG NFC technology was chosen to enable all new connected experiences with the Official Match Ball, the adidas Telstar 18. As the most innovative FIFA World Cup™ ball to date, the NFC technology allows the ball to interact with smartphones to display specific details of each ball and provides access to challenges, which users can enter in the run-up to the FIFA World Cup™.

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