UCODE 8 UHF RFID IC
NXP Semiconductors

UCODE 8 UHF RFID IC

Omnichannel Retail Data at unmatched Speed and Accuracy

Highest reading performance is ensured by 20% lower power consumption compared to other latest generation chips on the market. Application performance tests showed significant improvements in terms of speed and accuracy for inventory cycle counts.

With its high performance UCODE 8 also supports the retailer requests towards smaller label sizes.

Ralf Kodritsch

Ralf Kodritsch
Director Global Segment Manager RFID Solutions
Gratkorn, Austria

Product Category

Technologies

Application Fields

Sales Region

Key Facts

  • Read sensitivity -23dBm
  • Write sensitivity -18dBm
  • Innovative features: Self Adjust, Memory Safeguard, Untraceable, Pre-serialization for 96-bit EPC, Integrated Product Status Flag (PSF)
  • 16 bit Brand Identifier
  • Compatible with single-slit antenna
  • Up to 128-bit EPC
  • Up to 32 bit user memory
  • 96-bit Unique Tag Identifier (TID) factory locked, including 48-bit unique serial number
  • EPC Gen2v2

Applications

  • Smart Retail
  • Airline Baggage Tracking
  • Postal Services
  • Asset Tracking

NXP is the ideal choice for any RFID implementation.

NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer.

  • NXP’s IP core technologies in processing, connectivity and security enabling secure connections for a smarter world
  • Worldwide #1 leadership position in innovative high-performance mixed signal solutions in the identification and automotive industry
  • More than 9,000 issued and pending patent families
Solution News

NedCard takes step into the field of industrial RFID applications

NedCard brings MicroSON®-3 UHF RFID SMD Package with NXP’s UCODE® 8/ 8m RAIN RFID ICs to the market MicroSON®-3 is tailored to fit industrial application requirements and can be used in a variety of RFID solutions and markets. NedCard, experienced partner in RFID, proudly presents MicroSON®-3 SMD with the UHF Gen2v2 (RAIN) compliant, UCODE® 8 and UCODE® 8m chips from NXP Semiconductors. MicroSON®-3 is a small outline no-leads (SON) SMD package that can be embedded into industrial applications via printed circuit board, or PCB. MicroSON®-3 is small and very thin, yet robust enough to withstand harsh industrial processes and high temperatures. It is a near chip scale plastic encapsulated package with a copper lead frame substrate. The leadless package makes electrical contact by soldering the bottom surface terminals to the PCB. The small size of the MicroSON®-3 design makes it a perfect package for leading RAIN RFID tag chips.

Solution News

NXP Delivers New Connectivity to 2018 FIFA World Cup Finals

Smart Stadium Experience at 2018 FIFA World Cup Russia™ Finals As a pioneer and innovator for smart stadium solutions, NXP Semiconductors N.V. (NASDAQ:NXPI) today announced that with the use of its MIFARE® products, it helps bring secure, contactless ticketing to the ongoing 2018 FIFA World Cup Russia™ matches including the upcoming final game. The NXP contactless chip solution inside the match tickets provides fans with fast, hassle-free and safe access to Russia’s spectacular World Cup stadiums. Additionally, the company’s NTAG NFC technology was chosen to enable all new connected experiences with the Official Match Ball, the adidas Telstar 18. As the most innovative FIFA World Cup™ ball to date, the NFC technology allows the ball to interact with smartphones to display specific details of each ball and provides access to challenges, which users can enter in the run-up to the FIFA World Cup™.

NTAG 413 DNA NFC Chip
ICODE ILT HF RFID Chip
Cookies are necessary to provide you with our services. By continuing your visit on the website, you consent to the use of cookies.
More information Ok