NXP Semiconductors Enables Wi-Fi 6 Connectivity in Honor's Flagship Magic V Smartphone
NXP WLAN7207H front-end module combines design freedom with premium Wi-Fi 6 and Bluetooth performance to enable high performance smartphones.
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What's New
NXP® Semiconductors has announced that its WLAN7207H 2.4 GHz front-end integrated circuit (FEIC) enables Wi-Fi 6 connectivity in Honor’s flagship Magic V smartphone. The NXP WLAN7207x single FEM family provides routing and printed circuit board (PCB) design flexibility that enables optimized RF performance in a smartphone.
Why It Matters
To meet consumer needs, smartphones have become increasingly complex, creating challenges for the architectures and PCB designs. At the same time, consumers do not want to compromise on Bluetooth and Wi-Fi 6 performance, which delivers a number of enhancements over previous generations, including reduced latency and increased network capacity and efficiency. The WLAN7207x single FEM family offers designers more freedom in routing and placement on the PCB, enabling RF optimization that supports higher Wi-Fi 6 and Bluetooth performance.
More Details
“As consumers continue to rely on their smartphones for an ever-increasing list of data-driven benefits, Wi-Fi 6 addresses the need to move a rapidly expanding amount of data across more devices. Our FEIC solutions enable the Wi-Fi 6 performance benefits that consumers want while offering the design flexibility that OEMs need.”
Doeco Terpstra, Vice President and General Manager Smart Antenna Solutions, NXP
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“As smartphones have become more feature-rich, form-factor has become a differentiating feature for consumers. NXP’s FEM solution enabled us to overcome the increasing complexity and challenges presented by our flagship phone designs, while still offering the longer transmission range and improved signal quality consumers associate with Wi-Fi 6.”
George Zhao, CEO of Honor
